Design-for-test techniques utilized in an avionics computer MCM

Author

Wagner, Russell J. ; Jorgenson, Joel A.

Author_Institution

Rockwell Int. Corp., Cedar Rapids, IA, USA

fYear

1993

fDate

17-21 Oct 1993

Firstpage

373

Lastpage

382

Abstract

This paper highlights the development of a multichip module (MCM) design-for-testability methodology for an application intended for use in a fully electronic active matrix LCD flight instrument. MCM test issues discussed include design-for-testability, substrate test, known-good die (KGD), and module level test. The design incorporates IEEE 1149.1 and built-in-self-test features. Bare die pretest is accomplished with a ball grid array (BGA) chip carrier approach. The hardware consists of a mature digital design comprised of application specific and industry standard integrated circuits. Challenges and lessons learned are addressed along with next generation test approaches

Keywords

IEEE standards; aircraft computers; avionics; built-in self test; design for testability; multichip modules; IEEE 1149.1; active matrix LCD flight instrument; avionics computer MCM; ball grid array; Active matrix liquid crystal displays; Aerospace electronics; Application software; Circuit testing; Design for testability; Design methodology; Electronics packaging; Hardware; Instruments; Multichip modules;

fLanguage

English

Publisher

ieee

Conference_Titel

Test Conference, 1993. Proceedings., International

Conference_Location

Baltimore, MD

Print_ISBN

0-7803-1430-1

Type

conf

DOI

10.1109/TEST.1993.470675

Filename

470675