DocumentCode
1827335
Title
Peak Temperature Minimization for Embedded Systems with DVS Transition Overhead Consideration
Author
Qiu, Meikang ; Niu, Jianwei ; Pan, Fei ; Chen, Yu ; Zhu, Yongxin
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of Kentucky, Lexington, KY, USA
fYear
2012
fDate
25-27 June 2012
Firstpage
477
Lastpage
484
Abstract
Peak temperature is a critical issue in chip multiprocessor (CMP) architecture design. Dynamic Voltage Scaling (DVS) is used nowadays to reduce power consumption and peak temperature. However, traditional DVS in literature usually fails to take into consideration of task dependencies and voltage transition overhead such as energy consumption. In this paper, we propose the ROtation Scheduling and voltage Assignment (ROSA) algorithm, to minimize peak temperature under energy consumption constraints in voltage transition. We conduct experiments on Kernel Linux equipped with 4 Intel Core Quad CPUs. The experimental results demonstrate that our algorithm can reduce the peak temperature on chip with 4.9°C more comparing with the List Scheduling Solution (LSS).
Keywords
Linux; embedded systems; microprocessor chips; multiprocessing systems; power aware computing; processor scheduling; 4 intel core Quad CPU; CMP architecture design; DVS transition overhead consideration; Kernel Linux; LSS; ROSA algorithm; chip multiprocessor architecture design; dynamic voltage scaling; embedded systems; list scheduling solution; peak temperature; peak temperature minimization; power consumption reduction; rotation scheduling and voltage assignment algorithm; temperature-on-chip; voltage transition; Energy consumption; Equations; Processor scheduling; Program processors; Schedules; Scheduling; Voltage control; Thermal-aware; peak temperature; real-time constraint; task scheduling; voltage transition;
fLanguage
English
Publisher
ieee
Conference_Titel
High Performance Computing and Communication & 2012 IEEE 9th International Conference on Embedded Software and Systems (HPCC-ICESS), 2012 IEEE 14th International Conference on
Conference_Location
Liverpool
Print_ISBN
978-1-4673-2164-8
Type
conf
DOI
10.1109/HPCC.2012.71
Filename
6332210
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