• DocumentCode
    1827705
  • Title

    The influence of total quality management, concurrent engineering and knowledge management in a semiconductor manufacturing firm

  • Author

    Ng, P.K. ; Goh, G.G.G. ; Eze, U.C.

  • Author_Institution
    Fac. of Eng. & Technol., Multimedia Univ., Ayer Keroh, Malaysia
  • fYear
    2010
  • fDate
    7-10 Dec. 2010
  • Firstpage
    240
  • Lastpage
    244
  • Abstract
    For many years, total quality management, concurrent engineering and knowledge management have won considerable attention from industrial practitioners and academia. However, few studies have been conducted on the influence of these three practices among Malaysian manufacturing firms. Hence, the objective of this study is to analyse the influence of TQM, CE and KM on engineering performance in a Malaysian semiconductor manufacturing firm. For this study, surveys were used to obtain empirical data on these three practices. The data was analysed using multiple linear regression analysis. The findings indicated that TQM, CE and KM significantly influences the firm´s engineering performance with the three predictors explaining up to 53.9% of the variance in engineering performance. The findings of this study are useful to managers, engineers and researchers as it provides insights on specific areas that require adequate attention to ensure effective engineering performance.
  • Keywords
    concurrent engineering; knowledge management; semiconductor industry; total quality management; Malaysia; TQM; concurrent engineering; engineering performance; knowledge management; semiconductor manufacturing firms; total quality management; Concurrent engineering; Context; Knowledge management; Linear regression; Manufacturing; Product development; Total quality management; KM; TQM; concurrent engineering; engineering performance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Engineering and Engineering Management (IEEM), 2010 IEEE International Conference on
  • Conference_Location
    Macao
  • ISSN
    2157-3611
  • Print_ISBN
    978-1-4244-8501-7
  • Electronic_ISBN
    2157-3611
  • Type

    conf

  • DOI
    10.1109/IEEM.2010.5674457
  • Filename
    5674457