DocumentCode :
1827705
Title :
The influence of total quality management, concurrent engineering and knowledge management in a semiconductor manufacturing firm
Author :
Ng, P.K. ; Goh, G.G.G. ; Eze, U.C.
Author_Institution :
Fac. of Eng. & Technol., Multimedia Univ., Ayer Keroh, Malaysia
fYear :
2010
fDate :
7-10 Dec. 2010
Firstpage :
240
Lastpage :
244
Abstract :
For many years, total quality management, concurrent engineering and knowledge management have won considerable attention from industrial practitioners and academia. However, few studies have been conducted on the influence of these three practices among Malaysian manufacturing firms. Hence, the objective of this study is to analyse the influence of TQM, CE and KM on engineering performance in a Malaysian semiconductor manufacturing firm. For this study, surveys were used to obtain empirical data on these three practices. The data was analysed using multiple linear regression analysis. The findings indicated that TQM, CE and KM significantly influences the firm´s engineering performance with the three predictors explaining up to 53.9% of the variance in engineering performance. The findings of this study are useful to managers, engineers and researchers as it provides insights on specific areas that require adequate attention to ensure effective engineering performance.
Keywords :
concurrent engineering; knowledge management; semiconductor industry; total quality management; Malaysia; TQM; concurrent engineering; engineering performance; knowledge management; semiconductor manufacturing firms; total quality management; Concurrent engineering; Context; Knowledge management; Linear regression; Manufacturing; Product development; Total quality management; KM; TQM; concurrent engineering; engineering performance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industrial Engineering and Engineering Management (IEEM), 2010 IEEE International Conference on
Conference_Location :
Macao
ISSN :
2157-3611
Print_ISBN :
978-1-4244-8501-7
Electronic_ISBN :
2157-3611
Type :
conf
DOI :
10.1109/IEEM.2010.5674457
Filename :
5674457
Link To Document :
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