Title :
Automated wafer lot approval: A statistically based implementation
Author_Institution :
Hewlett Packard Co., Ft. Collins, CO, USA
Abstract :
A statistical process control (SPC) based tool for automated wafer lot approval has been developed and successfully implemented. This paper detail the prerequisites implemented prior to automated wafer lot approval, discuss the statistical methods and software implementation used to automate the disposition of each wafer, and present a study of that tool´s approval effectiveness on two products; one with low test yield variance and one with high test yield variance. Due to the mixed results of the initial implementation, additional methods of increasing the approval effectiveness are detailed
Keywords :
automatic testing; integrated circuit testing; integrated circuit yield; production testing; statistical process control; SPC; automated wafer lot approval; statistical process control; test yield variance; Automatic testing; Data engineering; Databases; Error analysis; Error correction; Process control; Production; Standards development; Statistical analysis; Tires;
Conference_Titel :
Test Conference, 1993. Proceedings., International
Conference_Location :
Baltimore, MD
Print_ISBN :
0-7803-1430-1
DOI :
10.1109/TEST.1993.470714
