Title :
Stacking of Known Good Reconstructed Wafer without TSV applications to memory-only and heterogeneous SiP
Author :
Val, Christian ; Noiray, Pascal Couderc J ; Boulay, Nadia
Author_Institution :
3D PLUS, France
Abstract :
A technological break based on Wafer Level Package started in 2002, consists in only stacking Known Good Reconstructed Wafer (what Freescale named: RCP and Infineon named eWLB) instead of standard wafers. This approach allows to have a very good yield, on the contrary of the W2W with TSV technologies. Several applications will be presented on the medical area, industrial area and smart card area.
Keywords :
ball grid arrays; system-in-package; three-dimensional integrated circuits; wafer bonding; wafer level packaging; Freescale; Infineon; RCP; TSV applications; TSV technology; W2W; eWLB; heterogeneous SIP; known good reconstructed wafer stacking; memory-only; standard wafers; technological break; wafer level package; Electronics packaging; Mechanical sensors; Pacemakers; Stacking; Three dimensional displays; Through-silicon vias;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th
Conference_Location :
Singapore
Print_ISBN :
978-1-4577-1983-7
Electronic_ISBN :
978-1-4577-1981-3
DOI :
10.1109/EPTC.2011.6184466
