DocumentCode
1828229
Title
Stacking of Known Good Reconstructed Wafer without TSV applications to memory-only and heterogeneous SiP
Author
Val, Christian ; Noiray, Pascal Couderc J ; Boulay, Nadia
Author_Institution
3D PLUS, France
fYear
2011
fDate
7-9 Dec. 2011
Firstpage
469
Lastpage
473
Abstract
A technological break based on Wafer Level Package started in 2002, consists in only stacking Known Good Reconstructed Wafer (what Freescale named: RCP and Infineon named eWLB) instead of standard wafers. This approach allows to have a very good yield, on the contrary of the W2W with TSV technologies. Several applications will be presented on the medical area, industrial area and smart card area.
Keywords
ball grid arrays; system-in-package; three-dimensional integrated circuits; wafer bonding; wafer level packaging; Freescale; Infineon; RCP; TSV applications; TSV technology; W2W; eWLB; heterogeneous SIP; known good reconstructed wafer stacking; memory-only; standard wafers; technological break; wafer level package; Electronics packaging; Mechanical sensors; Pacemakers; Stacking; Three dimensional displays; Through-silicon vias;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th
Conference_Location
Singapore
Print_ISBN
978-1-4577-1983-7
Electronic_ISBN
978-1-4577-1981-3
Type
conf
DOI
10.1109/EPTC.2011.6184466
Filename
6184466
Link To Document