• DocumentCode
    1828372
  • Title

    To inhibit the consumption of Cu during multiple reflows of Pb-free on Cu

  • Author

    Hu, Chih-Chia ; Hsiao, Hsiang-yao ; Guo, Ming-Yung ; Chen, Chih ; Tu, K.N.

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
  • fYear
    2011
  • fDate
    7-9 Dec. 2011
  • Firstpage
    503
  • Lastpage
    506
  • Abstract
    We report an effective approach to inhibit the consumption of Cu during multiple reflows of SnAg2.3 solder on Cu. By depositing a very thin layer of the solder on Cu and followed by a 10-min reflow, the scallop-type morphology of the interfacial Cu6Sn5 intermetallic compounds (IMCs) became flat and the channels between them closed up. When additional solder was deposited on the sample and reflowed again, the consumption of Cu as well as the growth the IMCs was retarded.
  • Keywords
    copper alloys; electronics packaging; metallisation; reflow soldering; silver alloys; tin alloys; Sn-Ag-Cu; copper consumption; during multiple reflow; interfacial intermetallic compounds; lead-free solder; scallop type morphology; Copper; Electronics packaging; Intermetallic; Materials; Morphology; Scanning electron microscopy; Soldering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4577-1983-7
  • Electronic_ISBN
    978-1-4577-1981-3
  • Type

    conf

  • DOI
    10.1109/EPTC.2011.6184472
  • Filename
    6184472
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1828372