Title :
Novel BiCMOS compatible, short channel LDMOS technology for medium voltage RF and power applications
Author :
Litwin, A. ; Bengtsson, O. ; Olsson, J.
Author_Institution :
Ericsson Microelectron., Kista, Sweden
Abstract :
We describe a very short channel, 0.15 /spl mu/m, LDMOS transistor, with a breakdown voltage of up to 45 V, manufactured in a standard 0.35 /spl mu/m BiCMOS process. At 1900 MHz and a 12 V supply voltage the 0.4 mm gate width device gives 100 mW output power P/sub 1/ /sub dB/ at a drain efficiency of 43%. It has a transducer power gain of more than 20 dB and a current gain cutoff frequency, f/sub T/, of 13 GHz. The maximum available gain cutoff frequency, f/sub MAX/, is 27 GHz. The LDMOS process module does not affect the performance or models of other devices. We present for the first time a simple way to create high voltage, high performance LDMOS transistors for RF power amplifier use even in a very downscaled silicon technology.
Keywords :
BiCMOS integrated circuits; UHF integrated circuits; UHF power amplifiers; integrated circuit technology; power MOSFET; power integrated circuits; semiconductor device breakdown; 0.15 micron; 0.35 micron; 0.4 mm; 100 mW; 12 V; 13 GHz; 1900 MHz; 20 dB; 27 GHz; 43 percent; 45 V; BiCMOS compatible LDMOS technology; HV LDMOS transistor; RF power amplifier; Si; breakdown voltage; downscaled Si technology; medium voltage RF applications; power applications; short channel LDMOS technology; BiCMOS integrated circuits; Cutoff frequency; High power amplifiers; Manufacturing processes; Medium voltage; Power generation; Radio frequency; Radiofrequency amplifiers; Silicon; Transducers;
Conference_Titel :
Microwave Symposium Digest, 2002 IEEE MTT-S International
Conference_Location :
Seattle, WA, USA
Print_ISBN :
0-7803-7239-5
DOI :
10.1109/MWSYM.2002.1011552