Submerged liquid jet impingement cooling

Author

Wang, Z.Y. ; Wong, T.N. ; Duan, F. ; Toh, K.C. ; Choo, K.F. ; Tan, S.P. ; Loh, C.V. ; Yeo, S.C.

Author_Institution

Sch. of Mech. & Aerosp. Eng., Nanyang Technol. Univ., Singapore, Singapore

fYear

2011

fDate

7-9 Dec. 2011

Firstpage

660

Lastpage

666

Abstract

In this paper, submerged liquid jet array impingement is proposed as a solution for the thermal management of the high performance electronics. Experiments were done using a submerged jet array of 285 nozzles of 0.5 mm diameter spaced 5.5 mm apart, machined on a 5 mm thick nozzle plate, with an impingement height of 3 mm. The temperature difference between the average heat source temperature and the inlet temperature decreases with the flow rate and increases with the heating power. The experimental Nusselt numbers agree well with the reported data in previous studies. Numerical studies were also conducted on a selected 16-nozzle module using the renormalization group (RNG) k-ε turbulence model. The temperature and velocity fields were obtained, and the average heat transfer coefficients from the numerical studies show good agreement with the experimental results.

Keywords

cooling; jets; nozzles; numerical analysis; renormalisation; thermal management (packaging); turbulence; 16-nozzle module; Nusselt numbers; RNG k-ε turbulence model; flow rate; heat source temperature; heat transfer coefficients; heating power; high performance electronics; inlet temperature; renormalization group k-ε turbulence model; size 0.5 mm; submerged liquid jet array impingement cooling; temperature fields; thermal management; velocity fields; Arrays; Cooling; Heat transfer; Numerical models; Resistance heating; Temperature measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th

Conference_Location

Singapore

Print_ISBN

978-1-4577-1983-7

Electronic_ISBN

978-1-4577-1981-3

Type

conf

DOI

10.1109/EPTC.2011.6184501

Filename

6184501