Title :
2011 IEEE 13th Electronics Packaging Technology Conference [front matter]
Abstract :
The following topics are dealt with: advanced packaging; electrical modeling & signal integrity; interconnection technologies; materials & processes; mechanical modeling & structural integrity; printed electronics; quality & reliability; thermal characterization & cooling solutions; wafer/package and IC testing.
Keywords :
cooling; electronics packaging; integrated circuit interconnections; integrated circuit reliability; integrated circuit testing; quality control; wafer level packaging; IC testing; advanced packaging; cooling solutions; electrical modeling; electronics packaging; interconnection technology; materials & processes; mechanical modeling; printed electronics; quality & reliability; signal integrity; structural integrity; thermal characterization; wafer-package;
Conference_Titel :
Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th
Conference_Location :
Singapore
Print_ISBN :
978-1-4577-1983-7
Electronic_ISBN :
978-1-4577-1981-3
DOI :
10.1109/EPTC.2011.6184506
