Innovative MEMS Wafer Level Packaging on bonding, molding and assembly process

Wafer Level Packaging (WLP) has started to thrive in recent years in IC packaging domain, especially in Micro-Electro-Mechanical Systems (MEMS) field due to its unique operating characteristic and design diversity. In this paper, several significant WLP technologies, including wafer to wafer (W2W) bonding, wafer level wire bonding, wafer level compound molding, and compound lapping, are disclosed in detail. A general concept of MEMS WLP assembly process flow is introduced and briefly explained. Furthermore, numerous experimental results regarding these technologies, including printing and bonding with glass frit, wire shift and loop height and ball strength analysis, warpage and wire sweep performance evaluation, wire extrusion using both traditional and novel approaches, have also been clearly demonstrated.