DocumentCode

1829602

Title

Study of Thin Underlayers to Hinder Contact Resistance Increase Due to Intermetallic Compound Formation

Author

Noël, S. ; Alamarguy, D. ; Correia, S. ; Gendre, P.

fYear

2009

fDate

14-16 Sept. 2009

Firstpage

155

Lastpage

161

Keywords

Aging; Chemical compounds; Coatings; Cobalt; Connectors; Contact resistance; Copper; Intermetallic; Nickel; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Contacts, 2009 Proceedings of the 55th IEEE Holm Conference on

Conference_Location

Vancouver, British Columbia, Canada

Print_ISBN

978-1-4244-3613-2

Electronic_ISBN

978-1-4244-3613-2

Type

conf

DOI

10.1109/HOLM.2009.5284409

Filename

5284409