Title :
Micro Motion Characteristics of Carbon Pastes on Rigid Circuit Boards
Author :
Gao, Jin Chun ; Xu, Liang Jun ; Yu, Xiao Xiang ; Luo, Guoping
Keywords :
Aging; Chemical compounds; Coatings; Cobalt; Contact resistance; Copper; Intermetallic; Nickel; Printed circuits; Tin;
Conference_Titel :
Electrical Contacts, 2009 Proceedings of the 55th IEEE Holm Conference on
Conference_Location :
Vancouver, British Columbia, Canada
Print_ISBN :
978-1-4244-3613-2
Electronic_ISBN :
978-1-4244-3613-2
DOI :
10.1109/HOLM.2009.5284410
