Title :
A CMOS photodiode model
Author :
Liu, Wei-Jean ; Chen, Oscal T C ; Dai, Li-Kuo ; Weng, Ping-Kuo ; Huang, Kaung-Hsin ; Jih, Far-Wen
Author_Institution :
Dept. of Electr. Eng., Nat. Chung Cheng Univ., Chia-Yi, Taiwan
Abstract :
This paper utilizes the concepts of equilibrium equations and minority carrier continuity to build and derive a CMOS photodiode model. By using the TSMC 1P3M 0.5 μm CMOS technology, photodiodes with two different types of Nwell-PEpitaxial-Psubstrate and Ndiffusion-Pwell-PEpitaxial-Psu bstrate were fabricated. Measurements were done to test the photoresponse from 400 nm to 1000 nm. To simulate the photoresponses of Nwell-PEpitaxial-Psubstrate and Ndiffusion-Pwell-PEpitaxial-Psu bstrate photodiodes using the proposed model, if an inadequate value of the surface recombination velocity which is affected by the surface defects in the manufacture process is utilized, the proposed model would yield a little larger error in estimating the photoresponse in a shorter wavelength. To overcome this problem, the curve mapping scheme is applied to find the adequate boundary condition of the surface recombination velocity with the least mean squared error thus allowing the proposed model to achieve a good performance. The concept of the model proposed herein could be utilized in designing any CMOS photodiode for simulating its photo-electronic characteristics in various industrial applications
Keywords :
CMOS integrated circuits; integrated optoelectronics; least mean squares methods; minority carriers; photodiodes; semiconductor device models; surface recombination; 0.5 micron; 400 to 1000 nm; CMOS photodiode model; TSMC IP3M CMOS technology; boundary condition; curve mapping scheme; equilibrium equations; least mean squared error; minority carrier continuity; photo-electronic characteristics; photoresponse testing; surface recombination velocity; CMOS technology; Equations; Manufacturing processes; Photodiodes; Semiconductor device modeling; Semiconductor process modeling; Substrates; Surface waves; Testing; Virtual manufacturing;
Conference_Titel :
Behavioral Modeling and Simulation, 2001. BMAS 2001. Proceedings of the Fifth IEEE International Workshop on
Conference_Location :
Santa Rosa, CA
Print_ISBN :
0-7803-7291-3
DOI :
10.1109/BMAS.2001.962505