DocumentCode
1829826
Title
Development of through glass tungsten via interconnect for 3D MEMS packaging
Author
Sun, Yu ; Yu, Daquan ; Yang, Shuangshou ; Sun, Xiaofeng ; Zhang, Jing ; Wei, Xiuzhen ; Wan, Lixi
Author_Institution
Inst. of Microelectron., Beijing, China
fYear
2011
fDate
7-9 Dec. 2011
Firstpage
774
Lastpage
776
Abstract
As the development of electronic devices, three-dimensional (3D) integration is the next generation of electrical packaging technique. Glass is another excellent material for packaging with lots of advantages. In this paper, we introduce novel tungsten filled through glass via wafer, simulated electronic characters and its application on MEMS.
Keywords
electronics packaging; glass; interconnections; micromechanical devices; semiconductor device manufacture; tungsten; 3D MEMS packaging; W; electrical packaging technique; electronic devices; glass; interconnect; three-dimensional integration; Glass; Micromechanical devices; Packaging; Radio frequency; Scanning electron microscopy; Silicon; Tungsten;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th
Conference_Location
Singapore
Print_ISBN
978-1-4577-1983-7
Electronic_ISBN
978-1-4577-1981-3
Type
conf
DOI
10.1109/EPTC.2011.6184531
Filename
6184531
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