DocumentCode
1829983
Title
Numerical analysis of drop/impact of portable measurement instrument
Author
Kung, Chieh
Author_Institution
Dept. of Comput. Applic. Eng., Far East Univ., Tainan, Taiwan
fYear
2011
fDate
17-20 Aug. 2011
Firstpage
884
Lastpage
888
Abstract
In recent years, the advancement of semiconductor technology has posted the demands of high integrity, high performance, mobility, and miniaturization onto measurement instruments. This trend is also prevailing on portable measurement and test instruments such as portable laser meters, portable laser levelers, handheld spectrum analyzers, palm-sized digital oscilloscopes, etc. Portable measurement instruments are prone to drop/impact with objects and, hence, are vulnerable to damage due to the shock load of impact. This paper aims at a study of drop/Impact responses of a commercially available potable measurement instruments. Free fall drops with three impact angles of 0°, 45°, and 90° are considered. The equivalent stresses (Von Mises stress) are evaluated at the PCB modules of the instrument. The results show that the subsequent impacts that follow the first impact also contribute noticeable dynamical effects to the PCB structure of the instrument. The results of this study can be the bases for the design of drop concerns of general portable measurement instruments.
Keywords
numerical analysis; portable instruments; printed circuits; PCB modules; handheld spectrum analyzers; mobility; numerical analysis; palm-sized digital oscilloscopes; portable laser levelers; portable laser meters; portable measurement instrument; semiconductor technology; test instruments; Finite element methods; History; Instruments; Integrated circuit modeling; Load modeling; Semiconductor device measurement; Stress; Drop/impact; Finite element analysis; Measurement devise/instruments; Numerical simulation;
fLanguage
English
Publisher
ieee
Conference_Titel
Fluid Power and Mechatronics (FPM), 2011 International Conference on
Conference_Location
Beijing
Print_ISBN
978-1-4244-8451-5
Type
conf
DOI
10.1109/FPM.2011.6045886
Filename
6045886
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