• DocumentCode
    1829983
  • Title

    Numerical analysis of drop/impact of portable measurement instrument

  • Author

    Kung, Chieh

  • Author_Institution
    Dept. of Comput. Applic. Eng., Far East Univ., Tainan, Taiwan
  • fYear
    2011
  • fDate
    17-20 Aug. 2011
  • Firstpage
    884
  • Lastpage
    888
  • Abstract
    In recent years, the advancement of semiconductor technology has posted the demands of high integrity, high performance, mobility, and miniaturization onto measurement instruments. This trend is also prevailing on portable measurement and test instruments such as portable laser meters, portable laser levelers, handheld spectrum analyzers, palm-sized digital oscilloscopes, etc. Portable measurement instruments are prone to drop/impact with objects and, hence, are vulnerable to damage due to the shock load of impact. This paper aims at a study of drop/Impact responses of a commercially available potable measurement instruments. Free fall drops with three impact angles of 0°, 45°, and 90° are considered. The equivalent stresses (Von Mises stress) are evaluated at the PCB modules of the instrument. The results show that the subsequent impacts that follow the first impact also contribute noticeable dynamical effects to the PCB structure of the instrument. The results of this study can be the bases for the design of drop concerns of general portable measurement instruments.
  • Keywords
    numerical analysis; portable instruments; printed circuits; PCB modules; handheld spectrum analyzers; mobility; numerical analysis; palm-sized digital oscilloscopes; portable laser levelers; portable laser meters; portable measurement instrument; semiconductor technology; test instruments; Finite element methods; History; Instruments; Integrated circuit modeling; Load modeling; Semiconductor device measurement; Stress; Drop/impact; Finite element analysis; Measurement devise/instruments; Numerical simulation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Fluid Power and Mechatronics (FPM), 2011 International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-8451-5
  • Type

    conf

  • DOI
    10.1109/FPM.2011.6045886
  • Filename
    6045886