DocumentCode
1830023
Title
Heat Affected Zone and inter-metallic´s formation in gold wire thermosonic bonding as function of wire material
Author
Premkumar, Jeromerajan ; Gopinath, Maasi ; Shie, Meng Yong ; Tay, Gary-TS
Author_Institution
Isolation Products Div., Avago Technol. Manuf. (Singapore) Pte. Ltd., Singapore, Singapore
fYear
2011
fDate
7-9 Dec. 2011
Firstpage
805
Lastpage
809
Abstract
The paper is focused on the Heat Affected Zone (HAZ) and Inter-Metallic Compound (IMC) formation in gold wire bonding using different dopants in gold wire material. The HAZ is studied as a function of different current in the free air ball settings. It has been identified that high Ca dopant containing gold wire significantly leads to less inter metallization reaction of components in between Gold and Aluminum when compared with low Ca dopant containing gold wire. Similarly high Ca dopant containing gold wire has less HAZ when compared to low Ca dopant containing gold wires. The detailed analysis has been carried out with the help optical microscopy, Field Emission Scanning Electron Microscope (FE-SEM) and Energy Dispersive X-ray (EDX) spectroscopy.
Keywords
X-ray chemical analysis; field emission electron microscopy; gold; lead bonding; metallisation; scanning electron microscopy; EDX; FE-SEM; HAZ; IMC formation; energy dispersive X-ray spectroscopy; field emission scanning electron microscope; gold wire bonding; gold wire material; gold wire thermosonic bonding; heat affected zone; intermetallic compound formation; intermetallization reaction; optical microscopy; Aluminum; Bonding; Calcium; Electronics packaging; Gold; Materials; Wires;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference (EPTC), 2011 IEEE 13th
Conference_Location
Singapore
Print_ISBN
978-1-4577-1983-7
Electronic_ISBN
978-1-4577-1981-3
Type
conf
DOI
10.1109/EPTC.2011.6184539
Filename
6184539
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