DocumentCode :
1830363
Title :
Multistage process monitoring using survival analysis regression models
Author :
Asadzadeh, S. ; Aghaie, A. ; Samimi, Y.
Author_Institution :
Dept. of Ind. Eng., K. N. Toosi Univ. of Technol., Tehran, Iran
fYear :
2010
fDate :
7-10 Dec. 2010
Firstpage :
2158
Lastpage :
2162
Abstract :
In this paper, we consider the monitoring of a multistage process in which the outgoing quality attribute is a reliability-related characteristic. To measure the tensile strength of such quality characteristics, the process output is commonly inspected under limited load conditions. As a result, we may encounter censored observations which demand a certain monitoring procedure. The monitoring scheme becomes more complicated when the censoring occurs due to variable competing risks as well. To address this critical issue, we propose a regression-adjusted CUSUM chart to effectively monitor a quality characteristic that may be right censored because of both fixed and variable competing risks. The result of a simulation study confirms the superiority of the proposed method in comparison with the existing one. The proposed control chart is applicable not only to reliability measures in manufacturing processes but also to similar quality indices in service operations such as survivability measures in healthcare services.
Keywords :
process monitoring; quality control; regression analysis; reliability; tensile strength; CUSUM chart; multistage process monitoring; quality attribute; reliability-related characteristic; service operations; survival analysis regression models; tensile strength; Control charts; Data models; Monitoring; Process control; Reliability; Semiconductor process modeling; Accelerated failure time (AFT) model; CUSUM control chart; Competing risk; Multistage process;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Industrial Engineering and Engineering Management (IEEM), 2010 IEEE International Conference on
Conference_Location :
Macao
ISSN :
2157-3611
Print_ISBN :
978-1-4244-8501-7
Electronic_ISBN :
2157-3611
Type :
conf
DOI :
10.1109/IEEM.2010.5674554
Filename :
5674554
Link To Document :
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