Title :
A peripheral switchable 3D stacked CMOS image sensor
Author :
Liu, Charles Chih-Min ; Chin-Hao Chang ; Hon-Yih Tu ; Chao, Calvin Yi-Ping ; Fu-Lung Hsueh ; Szu-Ying Chen ; Hsu, V. ; Jen-Cheng Liu ; Dun-Nien Yaung ; Shou-Gwo Wuu
Author_Institution :
Taiwan Semicond. Manuf. Co., Hsinchu, Taiwan
Abstract :
A 1.1 um pitch pixel array fabricated by 45 nm 3D stacked technology, can be switched to peripheral circuits on same wafer or to other stacked wafer for process and signal integrity verification. It supports through silicon connection or direct connection to increase the flexibility by separating pixel array and sensing circuit. The novel wide operation range VCO and low power serializer are implemented to reduce the total power and noise.
Keywords :
CMOS image sensors; low-power electronics; voltage-controlled oscillators; 3D stacked technology; direct connection; low power serializer; peripheral circuits; peripheral switchable 3D stacked CMOS image sensor; pitch pixel array; process verification; sensing circuit; signal integrity verification; silicon connection; size 45 nm; stacked wafer; wide operation range VCO; Abstracts; Arrays; CMOS integrated circuits; Heating; Inverters; Phase frequency detector; System-on-chip;
Conference_Titel :
VLSI Circuits Digest of Technical Papers, 2014 Symposium on
Conference_Location :
Honolulu, HI
Print_ISBN :
978-1-4799-3327-3
DOI :
10.1109/VLSIC.2014.6858370
