DocumentCode
183088
Title
A 6.67mW sparse coding ASIC enabling on-chip learning and inference
Author
Jung Kuk Kim ; Knag, Phil ; Chen, T. ; Zhengya Zhang
Author_Institution
Dept. of Electr. Eng. & Comput. Sci., Univ. of Michigan, Ann Arbor, MI, USA
fYear
2014
fDate
10-13 June 2014
Firstpage
1
Lastpage
2
Abstract
A sparse coding ASIC is designed to learn visual receptive fields and infer the sparse representation of images for encoding, feature detection and recognition. 256 leaky integrate-and-fire neurons are connected in a 2-layer network of 2D local grids linked in a 4-stage systolic ring to reduce the communication latency. Spike collisions are kept sparse enough to be tolerated to save power. Memory is divided into a core section to support inference, and an auxiliary section that is only powered on for learning. An approximate learning tracks only significant neuron activities to save memory and power. The 3.06mm2 65nm CMOS ASIC achieves an inference throughput of 1.24Gpixel/s at 1.0V and 310MHz, and on-chip learning can be completed in seconds. Memory supply voltage can be reduced to 440mV to exploit the soft algorithm that tolerates errors, reducing the inference power to 6.67mW for a 140Mpixel/s throughput at 35MHz.
Keywords
CMOS integrated circuits; application specific integrated circuits; feature extraction; image coding; image representation; integrated circuit design; learning (artificial intelligence); neural chips; systolic arrays; 2-layer network; 2D local grids; 4-stage systolic ring; CMOS ASIC; communication latency reduction; encoding; feature detection; feature recognition; frequency 310 MHz; frequency 35 MHz; leaky integrate-and-fire neurons; memory supply voltage; on-chip inference; on-chip learning; power 6.67 mW; size 65 nm; soft algorithm; sparse coding ASIC; sparse image representation; spike collisions; visual receptive field learning; voltage 1.0 V; voltage 440 mV; Encoding; Image coding; Memory management; Neurons; System-on-chip; Throughput;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Circuits Digest of Technical Papers, 2014 Symposium on
Conference_Location
Honolulu, HI
Print_ISBN
978-1-4799-3327-3
Type
conf
DOI
10.1109/VLSIC.2014.6858385
Filename
6858385
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