DocumentCode
1831585
Title
On-module power converter incorporating embedded inductors
Author
Brand, Michael
Author_Institution
Sensors & Electron. Syst., Raytheon Syst. Co., El Segundo, CA, USA
fYear
1998
fDate
17-19 Sep 1998
Firstpage
7
Abstract
Summary form only given, as follows. Distributed power architectures require high-density, low-profile, low-cost “on-module” converters to improve regulation and fault tolerance while reducing interconnect weight. Raytheon is developing VHF resonant power converters that are ideally suited for such applications. A key feature of this technology is the integration of all the circuit magnetic components into the circuit substrate
Keywords
inductors; modules; resonant power convertors; Raytheon; VHF resonant power converters; distributed power architectures; embedded inductors; fault tolerance; high-density convertors; low-cost converters; low-profile convertors; magnetic components; on-module power converter; regulation; Fault tolerance; Inductors; Integrated circuit interconnections; Lab-on-a-chip; Magnetic circuits; Magnetic resonance; Power system interconnection; Road transportation; Sensor systems; VHF circuits;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Power Packaging, 1998. IWIPP. Proceedings., IEEE International Workshop on
Conference_Location
Chicago, IL
Print_ISBN
0-7803-5033-2
Type
conf
DOI
10.1109/IWIPP.1998.722241
Filename
722241
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