Title :
R-processor: 0.4V resilient processor with a voltage-scalable and low-overhead in-situ error detection and correction technique in 65nm CMOS
Author :
Seongjong Kim ; Mingoo Seok
Author_Institution :
Columbia Univ., New York, NY, USA
Abstract :
This paper presents a design approach for upgrading the resiliency of ultra-low-voltage (ULV) microprocessors through a voltage-scalable and low-overhead in-situ error detection and correction (EDAC) technique. Particular efforts are made to overcome the poor voltage scalability and area/energy/throughput overhead of the existing EDAC techniques when applied to ULV designs. The 0.4 V, 16 b microprocessor employing the proposed EDAC and dynamic frequency scaling schemes is demonstrated in 65 nm. The microprocessor can (1) automatically modulate fCLK based on error flags across static/slow variations and (2) in-situ detect and correct the errors from fast dynamic variations, virtually eliminating timing margins. At a typical process/voltage/temperature (PVT) corner, the proposed design achieves 4.9× throughput and 59% energy efficiency improvement at only 9.5% area overhead over the baseline design under the worst-case timing margin.
Keywords :
CMOS digital integrated circuits; error correction; error detection; integrated circuit design; low-power electronics; microprocessor chips; CMOS process; EDAC technique; PVT; R-processor; ULV microprocessor design; area-energy-throughput overhead; dynamic frequency scaling schemes; efficiency 59 percent; energy efficiency; error flags; fCLK modulation; fast dynamic variations; process-voltage-temperature corner; resilient processor; size 65 nm; ultra-low-voltage microprocessors; voltage 0.4 V; voltage-scalable-low-overhead in-situ error detection and correction technique; word length 16 bit; worst-case timing margin; Erbium; Image edge detection; Latches; Switches; Throughput; Voltage control;
Conference_Titel :
VLSI Circuits Digest of Technical Papers, 2014 Symposium on
Conference_Location :
Honolulu, HI
Print_ISBN :
978-1-4799-3327-3
DOI :
10.1109/VLSIC.2014.6858421