A new bond strength test method for testing of bondable magnet wires

Author

Cussen, Thomas J.

Author_Institution

Rea Magnet Wire Co. Inc., Fort Wayne, IN, USA

fYear

1991

fDate

7-10 Oct 1991

Firstpage

30

Lastpage

32

Abstract

The present helical coil test method as specified in ASTM D-1676 and NEMA NW-1000 presents some difficulties when a wide range of wire sizes is being tested. Members of the NEMA Magnet Wire Technical Committee are currently engaged in the evaluation of new bond strength test methods which have been found to minimize these difficulties and provide more consistent results. The new method uses a tested figure-eight coil that is then bonded and tested with a stress/strain analyzer. The author explains the new test procedures and compares them to the existing ASTM and NEMA standards and a proposed IEC test for bondable winding wires. The results of the testing that has been performed to date on various sizes of bondable magnet wires are summarized. The method provides several advantages over the present helical coil method

Keywords

adhesion; coils; electronic equipment testing; insulated wires; standards; NEMA Magnet Wire Technical Committee; bond strength test method; bondable magnet wires; figure-eight coil; standards; stress/strain analyzer; test procedures; wire sizes; Bonding forces; Coils; IEC standards; Laboratories; Materials testing; Ovens; Spraying; Standards publication; Wire; Wounds;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Electronics Insulation Conference, 1991. Boston '91 EEIC/ICWA Exposition., Proceedings of the 20th

Conference_Location

Boston, MA

Print_ISBN

0-7803-0018-1

Type

conf

DOI

10.1109/EEIC.1991.162564

Filename

162564