DocumentCode :
1832445
Title :
Improvements and recent advances in nanocomposite capacitors using a colloidal technique
Author :
Agarwal, Vishal ; Chahal, Premjeet ; Tummala, Rao R. ; Allen, Mark G.
Author_Institution :
Dept. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear :
1998
fDate :
25-28 May 1998
Firstpage :
165
Lastpage :
170
Abstract :
In this work, a colloidal technique is used to improve the dielectric properties of nanocomposite materials and to achieve thin film deposition (<5 μm) on large area substrates using meniscus coating. Using this technique, improved particle dispersion is achieved, which in turn allows for higher volume loading (increased dielectric constant), small variation of dielectric constant across the substrate, and thin-film deposition with lower particle-induced defects. Appropriate dispersants and fillers particularly applicable to meniscus coating of these composite materials were found which allowed the coated and cured composite material to attain high relative dielectric constant (typical 40). Non-meniscus-coated samples with dielectric constants as high as 74 were achieved by varying the particle size distribution
Keywords :
coating techniques; colloids; multichip modules; particle reinforced composites; permittivity; thin film capacitors; MCM; colloidal technique; dielectric constant; dielectric properties; dispersants; fillers; meniscus coating; nanocomposite capacitors; particle dispersion; particle size distribution; particle-induced defects; Capacitors; Coatings; Composite materials; Dielectric constant; Dielectric substrates; Dielectric thin films; High-K gate dielectrics; Nanocomposites; Nanostructured materials; Sputtering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components &amp; Technology Conference, 1998. 48th IEEE
Conference_Location :
Seattle, WA
ISSN :
0569-5503
Print_ISBN :
0-7803-4526-6
Type :
conf
DOI :
10.1109/ECTC.1998.678687
Filename :
678687
Link To Document :
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