• DocumentCode
    1832853
  • Title

    Fluxless FC-soldering in O2 purged ambient

  • Author

    Kuhmann, J.F. ; Pedersen, E.H.

  • Author_Institution
    Mikroelektronik Centret, Denmark
  • fYear
    1998
  • fDate
    25-28 May 1998
  • Firstpage
    256
  • Lastpage
    258
  • Abstract
    This paper describes a straightforward approach to fluxless flip-chip soldering: bonding in ambient with reduced O2 partial pressure. Using as-deposited SnAg solder bumps and in-situ reflow, impressively strong self-alignment could be achieved, which resulted in a complete overlap of chip metallization and solder bumps. The results of this work have been successfully transferred to reflow furnaces with N2 and N2/H2 purge, suitable for batch processing
  • Keywords
    batch processing (industrial); flip-chip devices; microassembling; reflow soldering; SnAg; batch processing; chip metallization; flip-chip soldering; fluxless FC-soldering; in-situ reflow; purged ambient; reflow furnaces; self-alignment; solder bumps; Bonding; Electronic components; Failure analysis; Furnaces; Glass; Hydrogen; Laboratories; Metallization; Surface tension; Yttrium;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components & Technology Conference, 1998. 48th IEEE
  • Conference_Location
    Seattle, WA
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-4526-6
  • Type

    conf

  • DOI
    10.1109/ECTC.1998.678703
  • Filename
    678703
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1832853