Title :
Fluxless FC-soldering in O2 purged ambient
Author :
Kuhmann, J.F. ; Pedersen, E.H.
Author_Institution :
Mikroelektronik Centret, Denmark
Abstract :
This paper describes a straightforward approach to fluxless flip-chip soldering: bonding in ambient with reduced O2 partial pressure. Using as-deposited SnAg solder bumps and in-situ reflow, impressively strong self-alignment could be achieved, which resulted in a complete overlap of chip metallization and solder bumps. The results of this work have been successfully transferred to reflow furnaces with N2 and N2/H2 purge, suitable for batch processing
Keywords :
batch processing (industrial); flip-chip devices; microassembling; reflow soldering; SnAg; batch processing; chip metallization; flip-chip soldering; fluxless FC-soldering; in-situ reflow; purged ambient; reflow furnaces; self-alignment; solder bumps; Bonding; Electronic components; Failure analysis; Furnaces; Glass; Hydrogen; Laboratories; Metallization; Surface tension; Yttrium;
Conference_Titel :
Electronic Components & Technology Conference, 1998. 48th IEEE
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-4526-6
DOI :
10.1109/ECTC.1998.678703
