Title :
Notice of Retraction
Robust design of suspension arm based on stochastic design improvement
Author :
Rahman, M.M. ; Mohyaldeen, H.M. ; Noor, M.M. ; Kadirgama, K. ; Bakar, R.A.
Author_Institution :
Fac. of Mech. Eng., Univ. Malaysia Pahang, Kuantan, Malaysia
Abstract :
Notice of Retraction
After careful and considered review of the content of this paper by a duly constituted expert committee, this paper has been found to be in violation of IEEE´s Publication Principles.
We hereby retract the content of this paper. Reasonable effort should be made to remove all past references to this paper.
The presenting author of this paper has the option to appeal this decision by contacting TPII@ieee.org.
This paper presents the robust design of suspension arm using stochastic design improvement (SDI) technique based on Monte Carlo simulation. The main goal of this study is to identify the critical location and to determine the optimum design for the suspension arm. Aluminum alloys (AA7079-T6) are selected as a suspension arm materials. The structural model of the suspension arm was developed utilizing the Solid works. The finite element model and analysis were performed utilizing the finite element analysis code. SDI has been performed to the design. A target output behavior is selected from the output variables available in the analysis. The result shows that the lower arm design has a higher capability to stand higher (scale factor force) as 118.9 with the stress acted on lower arm is 574.2 MPa. The new parameter of material can be chose as optimum result for the lower suspension arm.
Keywords :
Monte Carlo methods; aluminium alloys; design engineering; finite element analysis; suspensions (mechanical components); Monte Carlo simulation; Solid works; aluminum alloys; finite element model; stochastic design improvement; suspension arm design; Analytical models; Computational modeling; Computer crashes; Correlation; Metals; Monte Carlo technique; SDI; design improvement; robust design; suspension arm;
Conference_Titel :
Mechanical and Electronics Engineering (ICMEE), 2010 2nd International Conference on
Conference_Location :
Kyoto
Print_ISBN :
978-1-4244-7479-0
DOI :
10.1109/ICMEE.2010.5558508