The analysis and control of pick-and-place process in flip-chip

This paper analyzes the pick-and-place process of the flip-chip technology, addressing two different control goals. Iterative learning control (ILC) is adopted to enhance the point-to-point positioning accuracy in the IC chip picking procedure. Furthermore, a trajectory modification is proposed for the traditional soft landing process, hence improving the efficiency of the IC chip placing procedure. Experimental results are provided to highlight the principles and practical applicability of the proposed methods.