Screen-printed copper superthick-films for power hybrids

Author

Lucat, C. ; Meni, F. ; Rachidi, M.O. ; Zardini, C. ; Bontemps, C.S. ; Despagne, P.

Author_Institution

Bordeaux I Univ., Talence, France

fYear

1998

fDate

17-19 Sep 1998

Firstpage

44

Lastpage

45

Abstract

So far, the thickness of screen-printed copper is not sufficient to drive large currents in high power modules. This paper describes a new fabrication process of copper superthick-films (300 μm), screen-printed on alumina substrates. Resistivity, peel strength, bonding strength and solderability measurements were performed for different firing conditions. As expected, the higher the firing temperature, the smaller the resistivity and the better the adhesion of the copper superthick-film. Moreover, the preliminary examination of a test vehicle using copper superthick-films shows a good thermomechanical behaviour, similar to that of DBC

Keywords

copper; hybrid integrated circuits; modules; power integrated circuits; soldering; 300 micron; Cu; bonding strength; firing conditions; high power modules; peel strength; power hybrids; resistivity; screen-printed superthick-films; solderability measurements; thermomechanical behaviour; Adhesives; Bonding; Conductivity; Copper; Fabrication; Firing; Multichip modules; Performance evaluation; Temperature; Testing;

fLanguage

English

Publisher

ieee

Conference_Titel

Integrated Power Packaging, 1998. IWIPP. Proceedings., IEEE International Workshop on

Conference_Location

Chicago, IL

Print_ISBN

0-7803-5033-2

Type

conf

DOI

10.1109/IWIPP.1998.722257

Filename

722257