DocumentCode
1833459
Title
A 7.39mm2 76mW (1944, 972) LDPC decoder chip for IEEE 802.11n applications
Author
Shih, Xin-Yu ; Zhan, Cheng-Zhou ; Wu, An-Yeu
Author_Institution
Grad. Inst. of Electron. Eng., Nat. Taiwan Univ., Taipei
fYear
2008
fDate
3-5 Nov. 2008
Firstpage
301
Lastpage
304
Abstract
This paper presents the LDPC decoder chip for (1944,972) QC-LDPC codes in IEEE 802.11n communication system. The efficient LDPC decoder chip is designed with three design techniques, including Group Comparison (GC), Dynamic Wordlength Assignment (DWA), and Data Packet Scheme (DPS). When the target BER is 10-6, the decoding performance can be improved by the coding gain of 0.48 dB and 0.63 dB with respect to (4,3) and (3,2) fixed-point NMSA, respectively. In addition, the total decoder design area can be reduced by 25% and the decoding throughput can be enhanced by 3X times with respect to conventional direct-mapping method. By using TSMC 0.13 um VLSI technology, the core area and die size are only 3.88 mm2 and 7.39 mm2, respectively. The maximum operating frequency is measured at 111.1 MHz and the power dissipation is only 76 mW.
Keywords
IEEE standards; VHF devices; VLSI; parity check codes; sequential decoding; wireless LAN; IEEE 802.11 n communication system; LDPC decoder chip; QC-LDPC codes; TSMC VLSI technology; data packet scheme; decoding performance; direct-mapping method; dynamic wordlength assignment; fixed-point NMSA; frequency 111.1 MHz; group comparison; low-density parity-check codes; power 76 mW; power dissipation; size 0.13 mum; wireless local area network standard; Communication systems; Decoding; Error correction codes; Frequency; Hardware; Parity check codes; Power dissipation; Sparse matrices; Throughput; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference, 2008. A-SSCC '08. IEEE Asian
Conference_Location
Fukuoka
Print_ISBN
978-1-4244-2604-1
Electronic_ISBN
978-1-4244-2605-8
Type
conf
DOI
10.1109/ASSCC.2008.4708787
Filename
4708787
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