• DocumentCode
    1833634
  • Title

    Impedance of an infinitely large parallel-plane pair and its applications in engineering modeling

  • Author

    Chada, Arun Reddy ; Zhang, Yaojiang ; Feng, Gang ; Drewniak, James L. ; Fan, Jun

  • Author_Institution
    Missouri S&T, Missouri Univ. of Sci. & Technol., Rolla, MO, USA
  • fYear
    2009
  • fDate
    17-21 Aug. 2009
  • Firstpage
    78
  • Lastpage
    82
  • Abstract
    In this paper, a closed-form expression for the impedance of an infinitely large parallel plane pair is presented. It is applicable to practical printed circuit board (PCB) design problems where there are multiple shorting vias around the signal vias of interest. With the presence of multiple shorting vias, reflections from the plane pair edges can be neglected since the shorting vias prevent the electromagnetic energy from leaking away from the local cavity around the signal vias. The self and transfer impedance expressions can be obtained using the expansion of cylindrical waves. The impedances calculated from both the rectangular cavity model and the infinitely large plane pair model for several design examples are compared to demonstrate the effectiveness of the infinite plane pair approximation.
  • Keywords
    electromagnetic wave reflection; printed circuit design; closed-form expression; cylindrical wave expansion; electromagnetic energy; engineering modeling; infinite plane pair approximation; multiple shorting vias; parallel-plane pair impedance; printed circuit board design; rectangular cavity model; transfer impedance; Circuit noise; Electromagnetic compatibility; Electromagnetic interference; Electromagnetic reflection; Electromagnetic scattering; Frequency estimation; Impedance; Laboratories; Printed circuits; Resonance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 2009. EMC 2009. IEEE International Symposium on
  • Conference_Location
    Austin, TX
  • Print_ISBN
    978-1-4244-4266-9
  • Electronic_ISBN
    978-1-4244-4058-0
  • Type

    conf

  • DOI
    10.1109/ISEMC.2009.5284626
  • Filename
    5284626