• DocumentCode
    1834048
  • Title

    Notice of Retraction
    Tribological simulation for the invalidation analysis of mould

  • Author

    Yan-fang Yin

  • Author_Institution
    Sch. of Mech. Eng., Wuhan Polytech. Univ., Wuhan, China
  • Volume
    1
  • fYear
    2010
  • fDate
    1-3 Aug. 2010
  • Abstract
    Notice of Retraction

    After careful and considered review of the content of this paper by a duly constituted expert committee, this paper has been found to be in violation of IEEE´s Publication Principles.

    We hereby retract the content of this paper. Reasonable effort should be made to remove all past references to this paper.

    The presenting author of this paper has the option to appeal this decision by contacting TPII@ieee.org.

    Based on the development of mould industry, the mould life analysis is made from selecting materials to factors affecting the mould life and invalidation of mould. Theoretical prediction of effective properties for materials is very important not only to analysis and optimization of material performance, but also to mould material validation. The effect of tribology problems in mould invalidation is obtained. The importance of tribology design is discussed in the mould design. The tribological problem was discussed for the mould design by invalidation analysis of mould. It was stated that surface strengthening is studied link to lubricant, developing new coating materials and environmental friendly lubricants are some important research methods in mould lubrication.
  • Keywords
    lubricants; machinery production industries; moulding; moulding equipment; tribology; wear resistance; coating material; invalidation analysis; lubricant; material performance; mould industry; mould life analysis; mould lubrication; surface strengthening; tribological simulation; Materials; Welding; die & mould; digital system; invalidation analysis; tribology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mechanical and Electronics Engineering (ICMEE), 2010 2nd International Conference on
  • Conference_Location
    Kyoto
  • Print_ISBN
    978-1-4244-7479-0
  • Type

    conf

  • DOI
    10.1109/ICMEE.2010.5558555
  • Filename
    5558555