Title :
A Microstrip Fixture Design for Power GaAs Fets
Author :
Lane, Richard Q.
Author_Institution :
California Eastern Laboratories
Abstract :
Small signal,(low power) devices can very adequately be In the new microstrip design the chip is die attached directly to a gold plated copper or brass carrier which is in intimate thermal contact with a finned aluminum heat sink. This results in an "unblown" thermal resistance of 3.S??C/Watt and a "blown" Rth of 1,6OC/Watt.
Keywords :
Calibration; Coplanar waveguides; FETs; Fixtures; Gallium arsenide; Heat sinks; Microstrip; Power measurement; Semiconductor device measurement; Thermal resistance;
Conference_Titel :
ARFTG Conference Digest-Spring, 33rd
Conference_Location :
Long Beach, CA, USA
Print_ISBN :
0-7803-5686-1
DOI :
10.1109/ARFTG.1989.323933
