DocumentCode
1834795
Title
Calibration and Measurement of Ceramic Microstrip Circuits Using a Wafer Probe Station
Author
Wallace, Jack E. ; Ellis, Grant A.
Author_Institution
High Technology Center, Boeing Aerospace and Electronics, Seattle, WA 98124
Volume
15
fYear
1989
fDate
15-16 June 1989
Firstpage
17
Lastpage
26
Abstract
Two methods for calibration and measurement of microstrip circuits fabricated on 10 mil thick alumina will be presented. The first method may be used from 7 to 30 GHz. The second method is best suited for measurements below 10 GHz. The basic measurement configuration consisted of: 1) an automatic network analyzer with thru-reflect-line (TRL) [l] calibration capability; 2) wafer probe station and coplanar probe heads normally used for measurement of GaAs circuits; and 3) microstrip TRL calibration standards with coplanar to microstrip transitions. Data will be presented on two types of coplanar to microstrip transitions including: 1) circuit dimensions; 2) transition data calibrated to the coplanar probe tips; 3) calibration data using microstrip TRL calibrations; 4) repeatability data of the transitions including circuit to circuit variations and substrate to substrate variations; and 5) error estimates.
Keywords
Calibration; Ceramics; Circuits; Delay; Frequency; Impedance; Insertion loss; Measurement standards; Microstrip; Probes;
fLanguage
English
Publisher
ieee
Conference_Titel
ARFTG Conference Digest-Spring, 33rd
Conference_Location
Long Beach, CA, USA
Print_ISBN
0-7803-5686-1
Type
conf
DOI
10.1109/ARFTG.1989.323934
Filename
4119500
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