• DocumentCode
    1834795
  • Title

    Calibration and Measurement of Ceramic Microstrip Circuits Using a Wafer Probe Station

  • Author

    Wallace, Jack E. ; Ellis, Grant A.

  • Author_Institution
    High Technology Center, Boeing Aerospace and Electronics, Seattle, WA 98124
  • Volume
    15
  • fYear
    1989
  • fDate
    15-16 June 1989
  • Firstpage
    17
  • Lastpage
    26
  • Abstract
    Two methods for calibration and measurement of microstrip circuits fabricated on 10 mil thick alumina will be presented. The first method may be used from 7 to 30 GHz. The second method is best suited for measurements below 10 GHz. The basic measurement configuration consisted of: 1) an automatic network analyzer with thru-reflect-line (TRL) [l] calibration capability; 2) wafer probe station and coplanar probe heads normally used for measurement of GaAs circuits; and 3) microstrip TRL calibration standards with coplanar to microstrip transitions. Data will be presented on two types of coplanar to microstrip transitions including: 1) circuit dimensions; 2) transition data calibrated to the coplanar probe tips; 3) calibration data using microstrip TRL calibrations; 4) repeatability data of the transitions including circuit to circuit variations and substrate to substrate variations; and 5) error estimates.
  • Keywords
    Calibration; Ceramics; Circuits; Delay; Frequency; Impedance; Insertion loss; Measurement standards; Microstrip; Probes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    ARFTG Conference Digest-Spring, 33rd
  • Conference_Location
    Long Beach, CA, USA
  • Print_ISBN
    0-7803-5686-1
  • Type

    conf

  • DOI
    10.1109/ARFTG.1989.323934
  • Filename
    4119500