Title :
An innovative methodology for evaluating multi-chip EMC in advanced 3G mobile platforms
Author :
Boulingui, S. Akue ; Dupoux, C. ; Baffreau, S. ; Sicard, E. ; Bouvier, N. ; Vrignon, B.
Author_Institution :
INSA-Lattis, Univ. of Toulouse, Toulouse, France
Abstract :
This paper presents an innovative approach which consists in emulating the behavior of a disruptive chip, by means of a specific probe, and analyzing the risks of interference with the victim component. Chip-to-chip interferences may be investigated without requiring any specific EMC test board. Details of this methodology are provided and illustrated in the case of a 3G mobile platform. Valuable information about the sensitive zones, coupling orientation and critical coupling distances are extracted easily using this approach.
Keywords :
3G mobile communication; electromagnetic compatibility; radiofrequency interference; EMC test board; advanced 3G mobile platforms; chip-to-chip interferences; disruptive chip; multichip EMC; Circuit testing; Costs; Coupling circuits; Electromagnetic compatibility; Immunity testing; Interference; Mobile handsets; Packaging; Probes; Risk analysis; 3G platforms; EMC; chip to chip coupling; mobile phone; near-field; system-in-package;
Conference_Titel :
Electromagnetic Compatibility, 2009. EMC 2009. IEEE International Symposium on
Conference_Location :
Austin, TX
Print_ISBN :
978-1-4244-4266-9
Electronic_ISBN :
978-1-4244-4058-0
DOI :
10.1109/ISEMC.2009.5284681