• DocumentCode
    1834984
  • Title

    An innovative methodology for evaluating multi-chip EMC in advanced 3G mobile platforms

  • Author

    Boulingui, S. Akue ; Dupoux, C. ; Baffreau, S. ; Sicard, E. ; Bouvier, N. ; Vrignon, B.

  • Author_Institution
    INSA-Lattis, Univ. of Toulouse, Toulouse, France
  • fYear
    2009
  • fDate
    17-21 Aug. 2009
  • Firstpage
    145
  • Lastpage
    150
  • Abstract
    This paper presents an innovative approach which consists in emulating the behavior of a disruptive chip, by means of a specific probe, and analyzing the risks of interference with the victim component. Chip-to-chip interferences may be investigated without requiring any specific EMC test board. Details of this methodology are provided and illustrated in the case of a 3G mobile platform. Valuable information about the sensitive zones, coupling orientation and critical coupling distances are extracted easily using this approach.
  • Keywords
    3G mobile communication; electromagnetic compatibility; radiofrequency interference; EMC test board; advanced 3G mobile platforms; chip-to-chip interferences; disruptive chip; multichip EMC; Circuit testing; Costs; Coupling circuits; Electromagnetic compatibility; Immunity testing; Interference; Mobile handsets; Packaging; Probes; Risk analysis; 3G platforms; EMC; chip to chip coupling; mobile phone; near-field; system-in-package;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 2009. EMC 2009. IEEE International Symposium on
  • Conference_Location
    Austin, TX
  • Print_ISBN
    978-1-4244-4266-9
  • Electronic_ISBN
    978-1-4244-4058-0
  • Type

    conf

  • DOI
    10.1109/ISEMC.2009.5284681
  • Filename
    5284681