• DocumentCode
    1835158
  • Title

    Notice of Retraction
    The effect of non-flat interfaces before weld on the Joint strengths of hot plate Welded parts

  • Author

    Shih-Jung Liu ; Yi-Ming Chou

  • Author_Institution
    Dept. of Mech. Eng., Chang Gung Univ., Taoyuan, Taiwan
  • Volume
    1
  • fYear
    2010
  • fDate
    1-3 Aug. 2010
  • Abstract
    Notice of Retraction

    After careful and considered review of the content of this paper by a duly constituted expert committee, this paper has been found to be in violation of IEEE´s Publication Principles.

    We hereby retract the content of this paper. Reasonable effort should be made to remove all past references to this paper.

    The presenting author of this paper has the option to appeal this decision by contacting TPII@ieee.org.

    Interface geometry before join has been an important factor for the welding quality of hot plate welding. In the present work, weld interfaces of six different geometries were studied. Three materials were used in the study: virgin polypropylene, and 20% and 30% glass-fiber reinforced polypropylene composites. After welding, the joint strength of the composites was determined by a tensile tester. Welded 20% glass fiber reinforced polymers were found to exhibit the highest joint strengths. For the parameters selected in the experiments, hot plate temperature, heating time and geometry of weld interface were found to be the principal factors affecting the joint property of hot plate welded composites.
  • Keywords
    adhesion; glass fibre reinforced plastics; plates (structures); quality control; tensile strength; tensile testing; welding; welds; glass fiber reinforced polymers; joint strengths; nonflat weld interfaces; plates; tensile testing; virgin polypropylene; welding quality; Geometry; Heating; Welding; hot plate welding; joint strengths; polypropylene composites; processing parameters; weld interface geometries;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mechanical and Electronics Engineering (ICMEE), 2010 2nd International Conference on
  • Conference_Location
    Kyoto
  • Print_ISBN
    978-1-4244-7479-0
  • Type

    conf

  • DOI
    10.1109/ICMEE.2010.5558601
  • Filename
    5558601