Low cost MCM-L fiber-optic transmitter package

A true implementation of MCM-L is accomplished by converting an existing fiber optic transmitter (FOTR) module fabricated by conventional technology in MCM-C, where high reliability has imposed hermeticity and established military standards and requirements. The MCM-L rendition provides a lower cost approach satisfying current budgets and high reliability without hermeticity. This MCM-L FOTR utilizes the latest laminate technological advances in order to achieve artwork routing parity of MCM-C, with comparable features to provide high density and miniaturization advanced microelectronic packaging that was not possible up until recently. Complete Chip on Board (COB) has been utilized to further advance miniaturization, also introducing flex input/output (I/O) leads integral to the MCM-L substrate. Extensive tests conducted after encapsulation providing excellent results both functionally and environmentally