Title :
Advanced flexible circuit materials as components for drift chambers and other applications
Author :
Dodsworth, Robert ; Geissinger, John
Keywords :
Adhesives; Building materials; Consumer electronics; Copper; Dielectric materials; Dielectric substrates; Flexible printed circuits; Inorganic materials; Metallization; Modular construction;
Conference_Titel :
Nuclear Science Symposium Conference Record, 2003 IEEE
Print_ISBN :
0-7803-8257-9
DOI :
10.1109/NSSMIC.2003.1352696
