DocumentCode
1835543
Title
A modified model of high-Tc superconducting interconnect propagation characteristics for VLSI packaging
Author
Kang, Linfeng ; Han, Ruqi ; Wang, Yangyuan
Author_Institution
Inst. of Microelectron., Beijing Univ., China
fYear
1995
fDate
24-28 Oct 1995
Firstpage
562
Lastpage
564
Abstract
Using a generalized two-fluid model, which can describe the anomalous superconducting properties of high-Tc superconductors, a modified model for the propagation characteristics of high-Tc superconducting (HTS) interconnect for VLSI packaging is given. By means of the numerical results, a simple semi-empirical expression for the rise time is given. Moreover, the results based on the modified model are compared with those based on the conventional model
Keywords
VLSI; high-temperature superconductors; integrated circuit interconnections; integrated circuit packaging; superconducting interconnections; transmission line theory; HTSC interconnect propagation characteristics; VLSI packaging; anomalous superconducting properties; high-Tc superconductors; microstrip transmission line; numerical results; rise time; semi-empirical expression; two-fluid model; Attenuation; High temperature superconductors; Microelectronics; Microstrip; Packaging; Superconducting materials; Superconducting transmission lines; Surface impedance; Very large scale integration; Yttrium barium copper oxide;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State and Integrated Circuit Technology, 1995 4th International Conference on
Conference_Location
Beijing
Print_ISBN
0-7803-3062-5
Type
conf
DOI
10.1109/ICSICT.1995.503351
Filename
503351
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