DocumentCode
1835570
Title
Calculation of radiated emission from chassis connected to PCB with screw
Author
Funato, Hiroki ; Suga, Takashi
Author_Institution
Automotive Product Res. & Lab., Hitachi America Ltd., MI, USA
fYear
2009
fDate
17-21 Aug. 2009
Firstpage
28
Lastpage
32
Abstract
Calculation technique to obtain radiated electric far-field from assembled device: chassis with PCB has been investigated. Circuit model including ground and power planes are created in PSPICE in order to calculate frequency spectrum of the current flowing through the screw at different location. Next, simplified 3D chassis model are created with simplified PCB model which does not have any traces or patterns. The relation between radiated electric field from the simplified model and the screw current is calculated from that 3D model. Lastly, the radiated electric field from the chassis with PCB has been calculated using both PSPICE circuit simulation results and the chassis 3D simulation results. The difference of far-field at different screw location from the calculation was up to 6 dB, which shows good correlation with measurement results.
Keywords
SPICE; circuit simulation; printed circuits; 3D chassis model; PCB; PSPICE circuit simulation; frequency spectrum; ground plane; power plane; radiated electric far-field; radiated emission; screw current; screw location; Assembly systems; Circuit simulation; Costs; Electromagnetic compatibility; Fasteners; Integrated circuit measurements; Laboratories; Power supplies; Product development; SPICE; PCB; chassis; grounding;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility, 2009. EMC 2009. IEEE International Symposium on
Conference_Location
Austin, TX
Print_ISBN
978-1-4244-4266-9
Electronic_ISBN
978-1-4244-4058-0
Type
conf
DOI
10.1109/ISEMC.2009.5284705
Filename
5284705
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