• DocumentCode
    1835570
  • Title

    Calculation of radiated emission from chassis connected to PCB with screw

  • Author

    Funato, Hiroki ; Suga, Takashi

  • Author_Institution
    Automotive Product Res. & Lab., Hitachi America Ltd., MI, USA
  • fYear
    2009
  • fDate
    17-21 Aug. 2009
  • Firstpage
    28
  • Lastpage
    32
  • Abstract
    Calculation technique to obtain radiated electric far-field from assembled device: chassis with PCB has been investigated. Circuit model including ground and power planes are created in PSPICE in order to calculate frequency spectrum of the current flowing through the screw at different location. Next, simplified 3D chassis model are created with simplified PCB model which does not have any traces or patterns. The relation between radiated electric field from the simplified model and the screw current is calculated from that 3D model. Lastly, the radiated electric field from the chassis with PCB has been calculated using both PSPICE circuit simulation results and the chassis 3D simulation results. The difference of far-field at different screw location from the calculation was up to 6 dB, which shows good correlation with measurement results.
  • Keywords
    SPICE; circuit simulation; printed circuits; 3D chassis model; PCB; PSPICE circuit simulation; frequency spectrum; ground plane; power plane; radiated electric far-field; radiated emission; screw current; screw location; Assembly systems; Circuit simulation; Costs; Electromagnetic compatibility; Fasteners; Integrated circuit measurements; Laboratories; Power supplies; Product development; SPICE; PCB; chassis; grounding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 2009. EMC 2009. IEEE International Symposium on
  • Conference_Location
    Austin, TX
  • Print_ISBN
    978-1-4244-4266-9
  • Electronic_ISBN
    978-1-4244-4058-0
  • Type

    conf

  • DOI
    10.1109/ISEMC.2009.5284705
  • Filename
    5284705