Title :
A general framework for SPICE-TLM interconnection
Author :
So, P.P.M. ; Hoefer, W.J.R.
Author_Institution :
Dept. of Electr. & Comput. Eng., Victoria Univ., BC, Canada
Abstract :
A general SPICE-TLM interconnection framework will be presented. The connection algorithm is based on the representation of the TLM network by equivalent Thevenin and/or Norton sources, The framework opens new and far-reaching possibilities for hybrid global microwave and high-speed digital circuit modeling in time domain because it integrates the extensive circuit and device models of SPICE into general three-dimensional field solutions in real time.
Keywords :
SPICE; digital integrated circuits; microwave integrated circuits; time-domain analysis; transmission line matrix methods; SPICE-TLM interconnection framework; connection algorithm; distributed device embedding; equivalent Norton sources; equivalent Thevenin sources; high-speed digital circuit modeling; hybrid global microwave circuit modeling; lumped device embedding; three-dimensional field solutions; time domain modeling; Computational electromagnetics; Coupling circuits; Integrated circuit interconnections; Laboratories; Microwave circuits; Microwave devices; SPICE; Scattering; Switches; Voltage;
Conference_Titel :
Microwave Symposium Digest, 2002 IEEE MTT-S International
Conference_Location :
Seattle, WA, USA
Print_ISBN :
0-7803-7239-5
DOI :
10.1109/MWSYM.2002.1011845
