• DocumentCode
    1835903
  • Title

    Electroplated hermetic fiber

  • Author

    Chen, Sara M.

  • Author_Institution
    SpecTran Specialty Opt. Co., Avon, CT, USA
  • fYear
    1998
  • fDate
    25-28 May 1998
  • Firstpage
    418
  • Lastpage
    420
  • Abstract
    SpecTran Specialty Optics Company has optimized a process to meet stringent requirements for conductive optical fiber pigtails. The plating process deposits Ni-P (nickel phosphorus), nickel, and gold onto a hermetic (carbon coated) optical fiber. These optimizations improve product yield. The carbon-silica to metal adhesion increases as the thickness of electroless nickel increases. The optimal electroless nickel thickness was studied and is presented. High shear forces are achieved on a soldered metalized pigtail assembly. The critical process parameters and the results of the process improvements are discussed with recommendations for the product applications
  • Keywords
    adhesion; electroplating; optical fibre fabrication; packaging; soldering; Au; Ni; NiP; adhesion; conductive optical fiber pigtails; electroplated hermetic fiber; product applications; product yield; shear forces; soldered metalized pigtail assembly; Adhesives; Chemicals; Gold; Nickel; Optical buffering; Optical fiber sensors; Optical fibers; Optical sensors; Packaging; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components & Technology Conference, 1998. 48th IEEE
  • Conference_Location
    Seattle, WA
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-4526-6
  • Type

    conf

  • DOI
    10.1109/ECTC.1998.678727
  • Filename
    678727