Title :
Electroplated hermetic fiber
Author_Institution :
SpecTran Specialty Opt. Co., Avon, CT, USA
Abstract :
SpecTran Specialty Optics Company has optimized a process to meet stringent requirements for conductive optical fiber pigtails. The plating process deposits Ni-P (nickel phosphorus), nickel, and gold onto a hermetic (carbon coated) optical fiber. These optimizations improve product yield. The carbon-silica to metal adhesion increases as the thickness of electroless nickel increases. The optimal electroless nickel thickness was studied and is presented. High shear forces are achieved on a soldered metalized pigtail assembly. The critical process parameters and the results of the process improvements are discussed with recommendations for the product applications
Keywords :
adhesion; electroplating; optical fibre fabrication; packaging; soldering; Au; Ni; NiP; adhesion; conductive optical fiber pigtails; electroplated hermetic fiber; product applications; product yield; shear forces; soldered metalized pigtail assembly; Adhesives; Chemicals; Gold; Nickel; Optical buffering; Optical fiber sensors; Optical fibers; Optical sensors; Packaging; Temperature;
Conference_Titel :
Electronic Components & Technology Conference, 1998. 48th IEEE
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-4526-6
DOI :
10.1109/ECTC.1998.678727