DocumentCode
1835903
Title
Electroplated hermetic fiber
Author
Chen, Sara M.
Author_Institution
SpecTran Specialty Opt. Co., Avon, CT, USA
fYear
1998
fDate
25-28 May 1998
Firstpage
418
Lastpage
420
Abstract
SpecTran Specialty Optics Company has optimized a process to meet stringent requirements for conductive optical fiber pigtails. The plating process deposits Ni-P (nickel phosphorus), nickel, and gold onto a hermetic (carbon coated) optical fiber. These optimizations improve product yield. The carbon-silica to metal adhesion increases as the thickness of electroless nickel increases. The optimal electroless nickel thickness was studied and is presented. High shear forces are achieved on a soldered metalized pigtail assembly. The critical process parameters and the results of the process improvements are discussed with recommendations for the product applications
Keywords
adhesion; electroplating; optical fibre fabrication; packaging; soldering; Au; Ni; NiP; adhesion; conductive optical fiber pigtails; electroplated hermetic fiber; product applications; product yield; shear forces; soldered metalized pigtail assembly; Adhesives; Chemicals; Gold; Nickel; Optical buffering; Optical fiber sensors; Optical fibers; Optical sensors; Packaging; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components & Technology Conference, 1998. 48th IEEE
Conference_Location
Seattle, WA
ISSN
0569-5503
Print_ISBN
0-7803-4526-6
Type
conf
DOI
10.1109/ECTC.1998.678727
Filename
678727
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