Title :
Modeling the electromagnetic behavior of parallel-plane interconnections
Author :
Leone, M. ; Friedrich, M.
Author_Institution :
Theor. Electr. Eng., OvG-Univ. of Magdeburg, Magdeburg, Germany
Abstract :
Vertical interconnections within parallel-plane structures as often encountered in electronic systems, may be responsible for signal-integrity issues and unintentional radiated emission. The analysis is based on an inductively-coupled equivalent-circuit model. For the required self- and mutual port inductances, exact closed-form expressions are presented. The investigation shows that the considered structure is inherently resonant at frequencies where the structure is still electrically small, depending on the number and the configuration of the ground interconnections. The radiated emission of the whole structure is determined from the capacitive current in the network model, based on a simple Hertzian-dipole radiation characteristic. The model is validated by numerical 3D full-wave field simulations and measurement.
Keywords :
electromagnetic coupling; equivalent circuits; inductance; integrated circuit interconnections; 3D full-wave field simulations; Hertzian-dipole radiation; capacitive current; electromagnetic behavior; electronic systems; ground interconnections; inductively-coupled equivalent-circuit; mutual port inductances; parallel-plane interconnections; parallel-plane structures; self-port inductances; signal-integrity; unintentional radiated emission; vertical interconnections; Analytical models; Impedance; Inductance; Integrated circuit interconnections; Integrated circuit modeling; Numerical models; Solid modeling;
Conference_Titel :
Electromagnetics in Advanced Applications (ICEAA), 2011 International Conference on
Conference_Location :
Torino
Print_ISBN :
978-1-61284-976-8
DOI :
10.1109/ICEAA.2011.6046283