• DocumentCode
    1836110
  • Title

    Modeling the electromagnetic behavior of parallel-plane interconnections

  • Author

    Leone, M. ; Friedrich, M.

  • Author_Institution
    Theor. Electr. Eng., OvG-Univ. of Magdeburg, Magdeburg, Germany
  • fYear
    2011
  • fDate
    12-16 Sept. 2011
  • Firstpage
    1396
  • Lastpage
    1399
  • Abstract
    Vertical interconnections within parallel-plane structures as often encountered in electronic systems, may be responsible for signal-integrity issues and unintentional radiated emission. The analysis is based on an inductively-coupled equivalent-circuit model. For the required self- and mutual port inductances, exact closed-form expressions are presented. The investigation shows that the considered structure is inherently resonant at frequencies where the structure is still electrically small, depending on the number and the configuration of the ground interconnections. The radiated emission of the whole structure is determined from the capacitive current in the network model, based on a simple Hertzian-dipole radiation characteristic. The model is validated by numerical 3D full-wave field simulations and measurement.
  • Keywords
    electromagnetic coupling; equivalent circuits; inductance; integrated circuit interconnections; 3D full-wave field simulations; Hertzian-dipole radiation; capacitive current; electromagnetic behavior; electronic systems; ground interconnections; inductively-coupled equivalent-circuit; mutual port inductances; parallel-plane interconnections; parallel-plane structures; self-port inductances; signal-integrity; unintentional radiated emission; vertical interconnections; Analytical models; Impedance; Inductance; Integrated circuit interconnections; Integrated circuit modeling; Numerical models; Solid modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetics in Advanced Applications (ICEAA), 2011 International Conference on
  • Conference_Location
    Torino
  • Print_ISBN
    978-1-61284-976-8
  • Type

    conf

  • DOI
    10.1109/ICEAA.2011.6046283
  • Filename
    6046283