DocumentCode
1836110
Title
Modeling the electromagnetic behavior of parallel-plane interconnections
Author
Leone, M. ; Friedrich, M.
Author_Institution
Theor. Electr. Eng., OvG-Univ. of Magdeburg, Magdeburg, Germany
fYear
2011
fDate
12-16 Sept. 2011
Firstpage
1396
Lastpage
1399
Abstract
Vertical interconnections within parallel-plane structures as often encountered in electronic systems, may be responsible for signal-integrity issues and unintentional radiated emission. The analysis is based on an inductively-coupled equivalent-circuit model. For the required self- and mutual port inductances, exact closed-form expressions are presented. The investigation shows that the considered structure is inherently resonant at frequencies where the structure is still electrically small, depending on the number and the configuration of the ground interconnections. The radiated emission of the whole structure is determined from the capacitive current in the network model, based on a simple Hertzian-dipole radiation characteristic. The model is validated by numerical 3D full-wave field simulations and measurement.
Keywords
electromagnetic coupling; equivalent circuits; inductance; integrated circuit interconnections; 3D full-wave field simulations; Hertzian-dipole radiation; capacitive current; electromagnetic behavior; electronic systems; ground interconnections; inductively-coupled equivalent-circuit; mutual port inductances; parallel-plane interconnections; parallel-plane structures; self-port inductances; signal-integrity; unintentional radiated emission; vertical interconnections; Analytical models; Impedance; Inductance; Integrated circuit interconnections; Integrated circuit modeling; Numerical models; Solid modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetics in Advanced Applications (ICEAA), 2011 International Conference on
Conference_Location
Torino
Print_ISBN
978-1-61284-976-8
Type
conf
DOI
10.1109/ICEAA.2011.6046283
Filename
6046283
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