Title :
MMIC Package Characterization with Active Loads
Author :
Phillips, Kurt ; Williams, Dylan
Author_Institution :
National Institute of Standards and Technology, 325 Broadway, Boulder, Colorado, 80303
Abstract :
A technique for characterizing microwave packages based on active PIN diode standards is discussed. The technique allows packages to be accurately characterized from external reflection coefficient measurements when a single bias-dependent active standard is embedded within it. The frequency characteristics, stability, and linearity of active PIN diode standards are investigated.
Keywords :
Calibration; Coplanar waveguides; Diodes; Integrated circuit packaging; MMICs; Measurement standards; Microwave theory and techniques; NIST; Reflection; Scattering parameters;
Conference_Titel :
ARFTG Conference Digest-Fall, 36th
Conference_Location :
Monterey, CA, USA
Print_ISBN :
0-7803-5686-1
DOI :
10.1109/ARFTG.1990.323997
