Title :
An effective alternative for marginal thermal improvements of semiconductor devices
Author :
Siegal, Bernie ; Berg, Mark
Author_Institution :
Opt. Associates Inc.
Abstract :
Using a variety of surface mount packages, this paper reports the results of using various different methods for improving semiconductor thermal performance. Starting off with a 64-lead Quad Flat Package (QFP), data are presented for several different thermal environment conditions and for several different package variations. The environmental conditions include still-air, heat sink and tape sink. The package variations studied include die attachment thickness, internal drop-in heat spreader, and encapsulant material variations. Data are also presented for two die-on-copper-slug packages (100-lead QFP and 44-lead PLCC) and for a standard (not thermally enhanced) package (56-lead SSOP), under still-air, moving-air, heat sink and tape sink environments
Keywords :
cooling; encapsulation; heat sinks; surface mount technology; thermal resistance; PLCC; QFP; SSOP; die attachment thickness; die-on-copper-slug packages; encapsulant material variations; heat sink; internal drop-in heat spreader; moving-air; plastic IC packages; quad flat package; semiconductor devices; still-air; tape sink; thermal environment conditions; thermal performance improvement; thermal resistance; Current measurement; Electronics packaging; Heat sinks; Heating; Plastic packaging; Semiconductor device packaging; Semiconductor devices; Temperature sensors; Thermal resistance; Voltage;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1994. SEMI-THERM X., Proceedings of 1994 IEEE/CPMT 10th
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-1852-8
DOI :
10.1109/STHERM.1994.288987