Title :
Microelectronics cooling and SEMI-THERM: a look back
Author_Institution :
IBM Corp., Poughkeepsie, NY, USA
Abstract :
For the occasion of the 10th anniversary of the SEMI-THERM conference, this paper provides a look back at some of the developments that have taken place since its founding. Topics covered include thermal measurement, thermal characterization, thermal analysis and modeling, air cooling, water cooling, and immersion cooling
Keywords :
cooling; integrated circuit technology; packaging; thermal analysis; thermal variables measurement; IC packages; air cooling; immersion cooling; microelectronics cooling; thermal analysis; thermal characterization; thermal measurement; thermal modeling; water cooling; Aerospace electronics; Application software; Computer aided manufacturing; Costs; Electron tubes; Electronic components; Electronics cooling; Integrated circuit packaging; Microelectronics; Modems;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1994. SEMI-THERM X., Proceedings of 1994 IEEE/CPMT 10th
Conference_Location :
San Jose, CA
Print_ISBN :
0-7803-1852-8
DOI :
10.1109/STHERM.1994.289000
