• DocumentCode
    1836953
  • Title

    W-band monopole antenna-in-system design approached on molding compound material

  • Author

    Jin, Cheng ; Li, Rui ; Zhang, Xiaowu ; Alphones, Arokiaswami

  • Author_Institution
    Inst. of Microelectron. (IME), Agency for Sci., Technol. & Res. (A*STAR), Singapore, Singapore
  • fYear
    2012
  • fDate
    27-29 Aug. 2012
  • Firstpage
    59
  • Lastpage
    60
  • Abstract
    A planar high-gain W-band unidirectional monopole antenna is designed on the molding compound (MC) material for highly integrated millimeter wave transceivers such as radio system-on-chip and radio system-in-package architectures. The antenna is designed based on the modification of the monopole antenna fed by a coplanar waveguide (CPW). The antenna, for the first time, is designed and fabricated on the MC package format to realize the integrated on-chip level circuit package antenna. Besides economical advantage of mass production and automatic assembly, the proposed design on MC material has potential benefit to the system-level board miniaturization and system-level manufacturing facility.
  • Keywords
    coplanar waveguide components; millimetre wave antennas; monopole antennas; moulding; planar antennas; system-in-package; system-on-chip; transceivers; CPW; MC material; MC package; W-band monopole antenna-in-system design; antenna design; automatic assembly; coplanar waveguide; mass production; millimeter wave transceiver; molding compound material; on-chip level circuit package antenna; planar high-gain W-band unidirectional monopole antenna; radio system-in-package architecture; radio system-on-chip; system-level board miniaturization; system-level manufacturing facility; Antenna feeds; Compounds; Coplanar waveguides; Materials; Reflector antennas; Molding Compound Material; W-band; antenna-in-system; monopole antenna;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation (APCAP), 2012 IEEE Asia-Pacific Conference on
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4673-0666-9
  • Type

    conf

  • DOI
    10.1109/APCAP.2012.6333139
  • Filename
    6333139