DocumentCode :
1837053
Title :
Using a Packaged Fet to Transform Between Measurement Media
Author :
Lane, Richard Q.
Author_Institution :
California Eastern Laboratories
Volume :
19
fYear :
1991
fDate :
13-14 June 1991
Firstpage :
94
Lastpage :
103
Abstract :
The recent availability of low cost HEMT devices in an improved stripline package useful to 26GH2, though exciting for the hybrid amplifier designer, poses new measurement problems for the device supplier. Hybrid applications are most commonly in microstrip, with the leads cropped short and soldered down. Therefore using an improved version of the TTF1 or even a full lead length microstrip fixture2, the \´S\´ parameters as measured will differ slightly from what they will be in the customer\´s application. If the port isolation is sufficient, then knowing the full lead fixture and application "end effects" "3\´ parameters permits transforming between the two media.
Keywords :
Cost function; FETs; Fixtures; Laboratories; Lead; Microstrip; Packaging; Q measurement; Strontium; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
ARFTG Conference Digest-Spring, 37th
Conference_Location :
Boston, MA, USA
Print_ISBN :
0-7803-5686-1
Type :
conf
DOI :
10.1109/ARFTG.1991.324024
Filename :
4119598
Link To Document :
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