DocumentCode
183739
Title
Device-to-circuit interactions in SiGe technology: Challenges and opportunities
Author
Cressler, J.D.
Author_Institution
Sch. of Electr. & Comput. Eng., N.W. Georgia Inst. of Technol., Atlanta, GA, USA
fYear
2014
fDate
Sept. 28 2014-Oct. 1 2014
Firstpage
45
Lastpage
55
Abstract
The tight coupling between the nuanced physics of silicon-germanium (SiGe) heterojunction bipolar transistors (HBTs) and the circuits in which they are utilized in many ways represents the “final frontier” for research in technology optimization, device physics, compact modeling, circuit design, and system implementations. As relevant examples of the inherent complexities associated with such “device-to-circuit interactions” within the SiGe world, I examine two distinct scenarios: 1) Our ability to accurately predict the end-of-life reliability of actual SiGe HBT circuits; and 2) Our ability to mitigate transient radiation effects in SiGe HBT circuits. In each example, I address the scope of the problem, the challenges faced in trying to solve them, and the opportunities presented if and when that success comes.
Keywords
Ge-Si alloys; heterojunction bipolar transistors; radiation hardening (electronics); semiconductor device models; semiconductor device reliability; SiGe; SiGe HBT circuits; SiGe heterojunction bipolar transistors; circuit design; compact modeling; device physics; device-to-circuit interactions; end-of-life reliability; silicon-germanium HBT; system implementations; technology optimization; transient radiation effects mitigation; Integrated circuit modeling; Integrated circuit reliability; Silicon germanium; Stress; Transistors; HBT; SiGe; TCAD; aging; circuits; device-to-circuit interactions; heterojunction bipolar transistor; modeling; radiation; reliability; silicon-germanium;
fLanguage
English
Publisher
ieee
Conference_Titel
Bipolar/BiCMOS Circuits and Technology Meeting (BCTM), 2014 IEEE
Conference_Location
Coronado, CA
Type
conf
DOI
10.1109/BCTM.2014.6981283
Filename
6981283
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