• DocumentCode
    183739
  • Title

    Device-to-circuit interactions in SiGe technology: Challenges and opportunities

  • Author

    Cressler, J.D.

  • Author_Institution
    Sch. of Electr. & Comput. Eng., N.W. Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2014
  • fDate
    Sept. 28 2014-Oct. 1 2014
  • Firstpage
    45
  • Lastpage
    55
  • Abstract
    The tight coupling between the nuanced physics of silicon-germanium (SiGe) heterojunction bipolar transistors (HBTs) and the circuits in which they are utilized in many ways represents the “final frontier” for research in technology optimization, device physics, compact modeling, circuit design, and system implementations. As relevant examples of the inherent complexities associated with such “device-to-circuit interactions” within the SiGe world, I examine two distinct scenarios: 1) Our ability to accurately predict the end-of-life reliability of actual SiGe HBT circuits; and 2) Our ability to mitigate transient radiation effects in SiGe HBT circuits. In each example, I address the scope of the problem, the challenges faced in trying to solve them, and the opportunities presented if and when that success comes.
  • Keywords
    Ge-Si alloys; heterojunction bipolar transistors; radiation hardening (electronics); semiconductor device models; semiconductor device reliability; SiGe; SiGe HBT circuits; SiGe heterojunction bipolar transistors; circuit design; compact modeling; device physics; device-to-circuit interactions; end-of-life reliability; silicon-germanium HBT; system implementations; technology optimization; transient radiation effects mitigation; Integrated circuit modeling; Integrated circuit reliability; Silicon germanium; Stress; Transistors; HBT; SiGe; TCAD; aging; circuits; device-to-circuit interactions; heterojunction bipolar transistor; modeling; radiation; reliability; silicon-germanium;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Bipolar/BiCMOS Circuits and Technology Meeting (BCTM), 2014 IEEE
  • Conference_Location
    Coronado, CA
  • Type

    conf

  • DOI
    10.1109/BCTM.2014.6981283
  • Filename
    6981283