Millimeter-wave SiGe RFICs for large-scale phased-arrays

This talk will present our latest work on silicon RFICs for phased-array applications with emphasis on very large chips with built-in-self-test capabilities, and for wafer-scale integration. SiGe is shown to be ideal for mm-wave applications due to its high temperature performance (automotive radars, base-stations, defense systems, etc.) and lower power consumption. These chips drastically reduce the cost of microwave and millimeter-wave phased arrays by combining many elements on the same chip, together with digital control. The phased-array chips also allow a much easier packaging scheme using either a multi-layer PCB or wafer-level packages. Examples from 30 GHz to 140 GHz will be presented, together with their system-level performance (imaging radars, packaging, antenna patterns, etc.).