Title :
Challenges in packaging a 4 chip FC MCM-L using KGD
Author :
Adamjee, Waseem ; Corona, Christina ; Czamowski, J.M. ; Eklund, Rick ; Guajardo, James ; Hedges, D. ; Youngblood, Alvin
Author_Institution :
Semicond. Products Sector, Motorola Inc., Austin, TX, USA
Abstract :
The FC MCM-L (Flip Chip MultiChip Module on Laminate) product is comprised of four Known Good Die (KGD) on 25×25 mm laminate substrate with solder clad bond pads. The FC MCM-L package was similar to that of single chip flip chip on laminate product with respect to assembly processing and material set. However, differences related to KGD, and the close proximity of die with minimal substrate real estate provided opportunities for process improvement. This paper describes the manufacturing processes and challenges encountered in the chip attach and underfill encapsulation processes. Finally, the MCM test and reliability results are discussed
Keywords :
circuit reliability; encapsulation; flip-chip devices; integrated circuit manufacture; microassembling; multichip modules; 25 mm; KGD; MCM reliability; MCM test; assembly processing; chip attach; flip chip MCM-L; four chip MCM; known good die; laminate substrate; manufacturing processes; packaging; solder clad bond pads; underfill encapsulation processes; Assembly; Bonding; Corona; Encapsulation; Flip chip; Laminates; Manufacturing processes; Semiconductor device packaging; Substrates; Testing;
Conference_Titel :
Electronic Components & Technology Conference, 1998. 48th IEEE
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-4526-6
DOI :
10.1109/ECTC.1998.678733
