Digital processor array implementation aspects of a 3D multi-layer vision architecture

Author

Foldesy, P. ; Carmona-Galan, R. ; Zarandy, A. ; Rekeczky, C. ; Rodriguez-Vazquez, A. ; Roska, Tamas

Author_Institution

Comput. & Autom. Res. Inst., Hungarian Acad. of Sciencies, Budapest, Hungary

fYear

2010

fDate

3-5 Feb. 2010

Firstpage

1

Lastpage

4

Abstract

Technological aspects of the 3D integration of a multilayer combined mixed-signal and digital sensor-processor array chip is described. The 3D integration raises the question of signal routing, power distribution, and heat dissipation, which aspects are considered systematically in the digital processor array layer as part of the multi layer structure. We have developed a linear programming based evaluation system to identify the proper architecture and its parameters.

Keywords

digital signal processing chips; linear programming; mixed analogue-digital integrated circuits; multiprocessing systems; 3D multilayer vision architecture; digital sensor processor array chip implementation; heat dissipation; linear programming based evaluation system; power distribution; signal routing; Communication system control; Computer architecture; Computer vision; Machine vision; Multicore processing; Navigation; Processor scheduling; Sensor arrays; Signal processing; Silicon; 3D integration; UAV navigation; sensor-processor;

fLanguage

English

Publisher

ieee

Conference_Titel

Cellular Nanoscale Networks and Their Applications (CNNA), 2010 12th International Workshop on

Conference_Location

Berkeley, CA

Print_ISBN

978-1-4244-6679-5

Type

conf

DOI

10.1109/CNNA.2010.5430274

Filename

5430274