Title :
Digital processor array implementation aspects of a 3D multi-layer vision architecture
Author :
Foldesy, P. ; Carmona-Galan, R. ; Zarandy, A. ; Rekeczky, C. ; Rodriguez-Vazquez, A. ; Roska, Tamas
Author_Institution :
Comput. & Autom. Res. Inst., Hungarian Acad. of Sciencies, Budapest, Hungary
Abstract :
Technological aspects of the 3D integration of a multilayer combined mixed-signal and digital sensor-processor array chip is described. The 3D integration raises the question of signal routing, power distribution, and heat dissipation, which aspects are considered systematically in the digital processor array layer as part of the multi layer structure. We have developed a linear programming based evaluation system to identify the proper architecture and its parameters.
Keywords :
digital signal processing chips; linear programming; mixed analogue-digital integrated circuits; multiprocessing systems; 3D multilayer vision architecture; digital sensor processor array chip implementation; heat dissipation; linear programming based evaluation system; power distribution; signal routing; Communication system control; Computer architecture; Computer vision; Machine vision; Multicore processing; Navigation; Processor scheduling; Sensor arrays; Signal processing; Silicon; 3D integration; UAV navigation; sensor-processor;
Conference_Titel :
Cellular Nanoscale Networks and Their Applications (CNNA), 2010 12th International Workshop on
Conference_Location :
Berkeley, CA
Print_ISBN :
978-1-4244-6679-5
DOI :
10.1109/CNNA.2010.5430274
